{"id":249,"count":1,"description":"Íæż½ã½ã\u2019s die sorting and inspection system provides inspection before die assembly to help engineers quickly identify any issues during the dicing process of wafer-level packages and bare dies. The evolution of wafer-level packaging technologies has introduced new materials into the process that can be susceptible to cracking during dicing such as low k materials in fan-in wafer-level packages. Our system assists chip manufacturers to decrease production risk by identifying defects quickly during die sorting to ensure higher outgoing quality to the next step in the assembly process for increasingly complex packages, widely adopted in markets such as communications, consumer, automotive and more.","link":"https:\/\/www.kla.com\/products\/packaging-manufacturing\/die-sorting-and-inspection","name":"Die Sorting and Inspection","slug":"die-sorting-and-inspection","taxonomy":"product_cat","parent":154,"meta":[],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.7 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Die Sorting and Inspection | Íæż½ã½ã<\/title>\n<meta name=\"description\" content=\"Íæż½ã½ã\u2019s die sorting and inspection systems identify defects during the dicing process of wafer-level packages to ensure high outgoing quality.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, 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