1.0Íæż½ã½ã/zh-hans等离子切割 101，第二部分 | 创新 | Íæż½ã½ãrich600338<blockquote class="wp-embedded-content" data-secret="fMJxxgnrLJ"><a href="/zh-hans/advance/innovation/plasma-dicing-101-part-ii">等离子切割 101，第二部分</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="/zh-hans/advance/innovation/plasma-dicing-101-part-ii/embed#?secret=fMJxxgnrLJ" width="600" height="338" title="《 等离子切割 101，第二部分 》—Íæż½ã½ã" data-secret="fMJxxgnrLJ" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script type="text/javascript">
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/wp-content/uploads/banner-14.jpg1390400切割发生在半导体工艺流程的末端。 此时，传统上，晶圆最终通过锯切或激光切割等方式被分为单块芯片/晶粒。 （查看我们的等离子切割101系列的第一篇文章，文章对刀片和激光等传统切割方法与等离子切割方法进行了比较）。