{"id":661,"count":7,"description":"Íæż½ã½ã\u2019s portfolio of process control solutions for the PCB manufacturing environment includes both automated optical inspection (AOI) systems for advanced defect inspection and panel metrology systems for 3D and 2D measurements. The AOI systems allow PCB and IC substrate manufacturers to find, identify and classify defects on any kind of PCB, including complex applications like semi-additive processes (SAP\/mSAP), high-density interconnect (HDI), any-layer and flip-chip structures. The multi-mode metrology systems enable a wide range of measurement applications for both test and inline panels. The resulting critical inspection and metrology information, augmented by artificial intelligence (AI) and machine learning (ML), allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield. ","link":"https:\/\/www.kla.com\/products\/pcb-ic-substrate-manufacturing\/inspection-metrology","name":"Inspection and Metrology","slug":"inspection-metrology","taxonomy":"product_cat","parent":655,"meta":[],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v24.7 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Inspection and Metrology | Íæż½ã½ã<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.kla.com\/zh-hans\/products\/pcb-ic-substrate-manufacturing\/inspection-metrology\" \/>\n<meta property=\"og:locale\" content=\"zh_CN\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Inspection and Metrology | Íæż½ã½ã\" \/>\n<meta property=\"og:description\" content=\"Íæż½ã½ã\u2019s portfolio of process control solutions for the PCB manufacturing environment includes both automated optical inspection (AOI) systems for advanced defect inspection and panel metrology systems for 3D and 2D measurements. The AOI systems allow PCB and IC substrate manufacturers to find, identify and classify defects on any kind of PCB, including complex applications like semi-additive processes (SAP\/mSAP), high-density interconnect (HDI), any-layer and flip-chip structures. The multi-mode metrology systems enable a wide range of measurement applications for both test and inline panels. 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