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Advanced Packaging Webinar Series (Part I) – Low Temperature Dielectric Deposition for Advanced Packaging

Aug 05, 2021

In this webinar we demonstrate how high quality PECVD dielectric films can be deposited at temperatures as low as 100¡ãC while maintaining high film quality and stability. We then discuss the use of these films in a number of advanced packaging applications.

SPTSCVDDepositionWebinar

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